Lavina Double Round-Segment Diamond Grinding Plate

Lavina Compatible Double Round Segment Diamond Grinding Plate

This yellow Lavina-compatible diamond grinding plate uses two round cylindrical diamond segments in a diagonal layout. The plate has a three-hole triangular mounting pattern, a rounded upper edge, straight lower edge and tapered sides.

Key Features

• Double round segments: two non-directional cylindrical diamond segments for concrete-floor grinding.
• Three-hole mounting plate: designed for Lavina-compatible tooling setups. Confirm your holder or adapter before ordering.
• 12 mm segment thickness: built for demanding floor-preparation work.
• Durable base: yellow manganese-steel plate with silver-grey diamond working faces.
• Configurable: 16, 30, 60, 80 and 120 grit; Soft, Medium and Hard bond options.

Compatible Machines

Compatible with Lavina 12, 16, 20, 21, 25, 30 and 38, plus Lavina S Series and X Series machines. This product has a three-hole plate interface; confirm whether your setup requires a direct mount or an adapter.

Applications

Suitable for removal, grinding and polishing work on concrete floors, epoxy floors, quartz and marble. Select the grit and bond according to the floor condition and required finish.

Selection Guide

• 16/30 grit: aggressive material removal and initial grinding.
• 60/80 grit: intermediate grinding and surface refinement.
• 120 grit: finer preparation before subsequent polishing steps.
• Soft bond: typically selected for hard concrete; Hard bond: typically selected for soft concrete; Medium bond: a general-purpose option.

Pack & Customization

Available as 1 Piece or 9 Pieces. Custom grit and bond configurations are available for wholesale and OEM orders.